Chipmaking giants such as Intel, Samsung, and TSMC see a future where the major parts of the silicon transistor are replaced with a semiconductor which is only a few atoms thick. Although he has reported progress towards that goal, the future is usually considered. More than a decadeNow A startup out of MIT feels that it has cracked the code to make commercial-scale 2D semiconductor, And hopefully chipmakers would have integrated them into advanced chips at that time.
CDIMEration has developed a procedure for molybdenum dysalfide (MOS (MOS)2),, A 2D semiconductor, at low-loving temperatures on silicon that it will not damage the underlying silicone circuit. This can allow the integration of layers of 2D transistors above the existing silicon circuit and eventually Multi-level 3D chips made From 2D device.
“Many people think of 2D semi-circulars that there is something that is still in the laboratory,” says CDIMENS CEO and Co-Founder. Jiadi Zhu“But 2D in CDIMENESion is a proprietary tool designed for content growth … and we have addressed a lot of important (2D content) problems about the reliability of the device, about the performance and variation of the device, the reliability of the device, and compatibility with silicon manufacturing processes.” Together, 2D semiconductors are ready to enter an industrial phase of development, they say.
Most of the plans of CDIMENS hinges on an ownership process that uses to develop the same layer of MOS2 On silicon and other substrates at only 200 ° C in the entire 300 millimeters wafers. The 2D content is made by chemical vapor statement, in which evaporated precursor chemicals react to coat it on a surface. But usually the temperature requires above 1000 ° C for reactions to create 2D content. This is so high that it will damage any underlying structures required to create a transistor. Today, researchers get 2D semiconductor separately and get it around that problem and then it is transferred to a silicone wafer. But the system of CDIMEration can correct the material on the silicon wafer without loss.
2D semiconductor business
Currently, a part of the startup business is to ship silicone wafers with 2D content, so that customers can evaluate it and manufacture equipment. Alternatively, customers can send wafers that have already been processed so that they have silicone circuits or structures on them. CDIMES may then develop MOS2 Or other 2D materials that send back to customers, so that they can integrate a layer of 2D devices with their silicone circuit.
A test wafer made with the process of CDIMEration sits under a microscope.Marginal
The latter may be the first industrial entry of the 2D semiconductor. “We are showing possibilities with silicon plus 2D content,” Zhu says. “But 2D content can also be used for excessive scale logic devices. This may be the next step.”
Like chipmakers Intel, SamsungAnd TSMC Reported research is aimed at replacing silicon nanoset in its future transistors with MOS.2 And on other 2D semiconductor IEEE International Electron Device Meeting In December 2024. At the same conference, Zhu and their colleagues from IEEE Fellow’s MIT laboratories Tomus palasios And Jing kong Showed that Low temperature synthesis can produce mos2 Transistor With several stacked channels, for Nanoset transistors. ,
A major inspiration to go with 2D semiconductors is to reduce power consumption, says Zhu. When they (dynamic strength) and when they are on closed (static power), both transistors lose power. Because it is only 0.6 nanometer thick, 2D transistors have properties that can allow them to operate using about half a voltage of today’s silicone devices, which saves dynamic power. When they stop, the leakage current is that you have to worry the most. But moss2 There is a bandgap that exceeds the value of silicon, which means that it takes too much energy for charge to leak in the device. Zhu says that the equipment created using CDIMEration materials is eaten at least one thousandth as the energy of silicone devices.
In addition to mos2Which is an electron-operator (N-type) semiconductor, startup tungsten disleinide, a p-type semiconductor, as well as 2D insulating films, such as hexagonal boron nitride. If 2D semiconductors will need a complete combination to handle the future CMOS chips anytime.
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