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    Home»Web3»Samsung Exynos 2600 SOC for better cooling heat pass block component: Report
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    Samsung Exynos 2600 SOC for better cooling heat pass block component: Report

    PineapplesUpdateBy PineapplesUpdateJuly 29, 2025No Comments3 Mins Read
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    Samsung Exynos 2600 SOC for better cooling heat pass block component: Report
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    According to a report, Samsung’s Exynos 2600 SoC can be equipped with a new component that improves thermal management on the processor. For flagship chipset, the company’s EXYNOS 2500 heirs of chipset, and are said to have produced using 2Nm process technology. This is expected to power the series of next year’s Samsung Galaxy S26 smartphones. Recent benchmark results have suggested that EXYNOS 2600 GPU tests may beat last year’s Snapdragon 8 Elite Chip, but lags behind in CPU performance.

    Samsung Electronics is expected to finish Exynos 2600 tests by October

    A month after Samsung unveiled the Exynos 2500 SoC, ZDNET Korea reports that the company has developed Custom component made using copper It will be integrated with semiconductor package. Publication also claims that these reforms will help the company improve the performance of smartphones’ Samsung Galaxy S25 series of Samsung Galaxy S25 series, which is equipped with Custom Snapdragon 8 Elite for Galaxy Chips to Galaxy Chips.

    According to the report, the South Korean tech group is developing a method to introduce a new heat pass block (HPB) component inside the semiconductor package for the Exynos 2600 chip with DRAM. The test for the chip is reportedly expected to be wrapped by October.

    Having close to the chip can allow more effective heat wastage from mobile processors, and can help solve an overheating issues that have plagued several chips from the company. The company currently uses package-on-package (POP) and fan-out wafer-level packaging (Fowlp) for the previous EXYNOS processor.

    This is not the first time that the details of Exynos 2600 have been viewed online. The chipset was recently seen as an internal device on Geekbench, which was named S5E9965. It scored 2,155 and 7,788 points on single core and multi -core tests respectively. These are slightly lower than the score obtained by Snapdragon 8 Elite, which strengthens most handsets in 2025.

    However, recently alleged Exynos 2600 SoC GPU’s 3dmark benchmark score has leaked that upcoming chipset Snapdragon 8 Elite can beat Soc in GPU performanceHowever, it is worth noting that Qualcomm is expected to launch its next generation Snapdragon 8 Elite 2 in September, so Exynos 2600 may have a more powerful contestant within the next few months.

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    Samsung Exynos 2600 SOC for better cooling heat pass block component: Report

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    Samsung Exynos 2600 SOC for better cooling heat pass block component: Report

    block component cooling exynos heat pass Report Samsung SOC
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