Snapdragon X2 Elite, Copilot+ PCS is allegedly tested in the company, successor for Qualcomm’s first generation processor. According to the descriptions shared by the recent Vinfut’s Rolland Quandt on Bluuski, the chipmaker is testing its next flagship chipset with 64 GB RAM. Qualcomm is also expected to equip Snapdragon X2 Elite Chip with a 50 percent more CPU core compared to the X elite, unveiling in 2023. The upcoming processor also gets the facility of Qualcomm’s In-House Oran V3 CPU core.
Snapdragon X2 Elite is likely to facilitate 50 percent more CPU core
In a post on Blussky, Quandt stated that a SC8480XP chipset (or SD X2 Elite) is currently being tested by chipmaker with 64 GB RAM. He also said that it is rapidly likely that Snapdragon X2 Elite will be equipped with 18 CPU core.
If these claims are accurate, the Snapdragon X2 Elite will be equipped with 50 percent more than the company’s first generation chipset. Snapdragon X Elite, unveiled in October 2023, was painted between 10 and 12 Oyon CPU core.
Kwandt earlier claimed that a version of Snapdragon X2 Elite would be equipped With 48GB RAM And a 1TB Nvme SSD. Their latest post shows that the chip may also be available in a high memory configuration.
Snapdragon X2 Elite Chip Package (or SIP) is expected to have a system, which means that Rama will be integrated with chipset for better performance. Apple silicone processors also use similar techniques to offer optimized performances.
Last year, Winfuture reported that the Qualcomm model number was working on a Snapdragon X2 Elite Chip with SC8480XP, named “Glimeur” or “Project Gl ben”. This is an interesting option, because Qualcomm is usually used by codenames based on places in Hawaii (Snapdragon X Elite was named Kodenmade Hamoa).
There was no mention of the new Snapdragon X series chips in Computex 2025, which indicates that next time we can expect to hear about these chips from Qualcomm, we will be at our Snapdragon summit in September. The company is expected to unveil Snapdragon 8 Elite 2 in its annual program as its major mobile chipset.
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