Xiaomi Xring O1 dye shot shows 10-core CPU, 6-core NPU and more details

Xiaomi unveiled Xring O1 on Thursday as its first in-house chipset for Xiaomi 15S Pro, and the details of the chipset have now surfaced online. It is a 3Nm chip made using Taiwan Semacist Manufacturing Company (TSMC) Advanced N3E Process Technology, which was also used by Apple, MediaTek and Qualcomm for its own 3Nm processor. Xring O1 will be avalable on smartphones in China, and includes 10-core CPU, 6-core NPU and 16-core GPU.

Xring O1 contains 10-core CPU and 6-core NPU

A dye shot of the new Xring O1 posted by the user Colonel (@Kurnalsalts) on X (East) gives us a close look at the new chipset from Xiaomi (Through Notebookchak). According to the user, the new Xiaomi Xring O1 has a dye area of ​​114.7 square mm (10.8 × 10.6 mm) and components take place 109.5 mm.

As a result, Xiaomi’s 3Nm SoC is small as a rival flagship chipset, which is also created using TSMC’s N3E process technology. The dye shot also reveals the layout of various components including CPU, GPU and NPU core on the new chip.

The new Xring O1 chip from Xiaomi is equipped with 10-core CPU which includes two arm cortex-X925 core (3.9GHz), six cortex-A725 core (up to 3.4GHz), and two Cortex-A520 (1.8GHz) core. It has a 16-core arm Immortalis-G925 MP16 GPU and 6-core NPU. Both CPU and NPU are equipped with 16MB cash.

The dye show also shows that Xring O1 will provide support for LPDDR5T RAM at 9,600Mbps. It also has a sensor hub and an unknown encryption core. The chip does not reveal the appearance of a modem, which means that Xiaomi 15S Pro will be equipped with another modem.

According to the recent benchmark results for Xring O1, it was suggested that the chip may offer performance that is at the time of Qualcomm with the flagship Snapdragon 8 Elite. It remains to be seen whether Xiaomi incorporates Xring O1 chip on more smartphone models in the future.